LM2502是TI公司的一款便携式串行器/解串器产品,LM2502是Mobile Pixel Link (MPL) 显示接口串行器和解串器,本页介绍了LM2502的产品说明、应用、特性等,并给出了与LM2502相关的TI元器件型号供参考。
LM2502 - Mobile Pixel Link (MPL) 显示接口串行器和解串器 - 便携式串行器/解串器 - 串行器、解串器 - TI公司(Texas Instruments,德州仪器)
The LM2502 device is a dual link display interface SERDES that adapts existing CPU / video busses to a low power current-mode serial MPL link. The chipset may also be used for a RGB565 application with glue logic. The interconnect is reduced from 22 signals to only 3 active signals with the LM2502 chipset easing flex interconnect design, size and cost.
The Master Serializer (SER) resides beside an application processor or baseband processor and translates a parallel bus from LVCMOS levels to serial MPL levels for transmission over a flex cable and PCB traces to the Slave Deserializer (DES) located near the display module.
Dual display support is provided for a primary and sub display through the use of two ChipSelect signals. A Mode pin selects either a i80 or m68 style interface.
The Power_Down (PD*) input controls the power state of the MPL interface. When PD* is asserted, the MD1/0 and MC signals are powered down to save current.
The LM2502 implements the physical layer of the MPL Standard (MPL-0). The LM2502 is offered in NOPB (Lead-free) NFBGA and WQFN packages.
- >300 Mbps Dual Link Raw Throughput
- MPL Physical Layer (MPL-0)
- Pin Selectable Master / Slave Mode
- Frequency Reference Transport
- Complete LVCMOS / MPL Translation
- Interface Modes:
- 16-bit CPU, i80 or m68 Style
- RGB565 with Glue Logic
- −30°C to 85°C Operating Range
- Link Power Down Mode Reduces IDDZ < 10 µA
- Dual Display Support (CS1* & CS2*)
- Via-less MPL Interconnect Feature
- 3.0V Supply Voltage (VDD and VDDA)
- Interfaces to 1.7V to 3.3V Logic (VDDIO)