The LMH2180 is a high speed dual clock buffer designed for portable communications and applications requiring multiple accurate multi-clock systems. The LMH2180 integrates two 75 MHz low noise buffers with independent shutdown pins into a small package. The LMH2180 ensures superb system operation between the baseband and the oscillator signal path by eliminating crosstalk between the multiple clock signals.

Unique technology and design provides the LMH2180 with the ability to accurately drive both large capacitive and resistive loads. Low supply current combined with shutdown pins for each channel means the LMH2180 is ideal for battery powered applications. This part does not use an internal ground reference, thus providing additional system flexibility.

The flexible buffers provide system designers the capacity to manage complex clock signals in the latest wireless applications. Each buffer delivers 106 V/μs internal slew rate with independent shutdown and duty cycle precision. Each input is internally biased to 1V, removing the need for external resistors. Both channels have rail-to-rail inputs and outputs, a gain of one, and are AC coupled with the use of one capacitor.

Replacing a discrete buffer solution with the LMH2180 provides many benefits: simplified board layout, minimized parasitic components, simplified BOM, design durability across multiple applications, simplification of clock paths, and the ability to reduce the number of clock signal generators in the system. The LMH2180 is produced in the tiny packages minimizing the required PCB space.

• (Typical Values are: VSUPPLY = 2.7V and CL = 10 pF, unless Otherwise Specified.)
• Small Signal Bandwidth 78 MHz
• Supply Voltage Range 2.4V to 5V
• Phase Noise (VIN = 1 VPP, fC = 38.4 MHz, Δf = 1 kHz) −123 dBc/Hz
• Slew Rate 106 V/μs
• Total Supply Current 2.3 mA
• Shutdown Current 30 µA
• Rail-to-Rail Input and Output
• Individual Buffer Enable Pins
• Rapid Ton Technology
• Crosstalk Rejection Circuitry
• Packages:
  • 8-Pin WSON, Solder Bump and no Pullback
  • 8-Bump DSBGA
• Temperature Range −40°C to 85°C