OMAP3525 and OMAP3530 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture.

The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

Streaming video 3D mobile gaming Video conferencing High-resolution still image

The device supports high-level operating systems (OSs), such as:

Linux Windows CE

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core POWERVR SGX™ subsystem for 3D graphics acceleration to support display and gaming effects (3530 only) Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out. Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex&trade adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption. Memory stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP25 and OMAP3530 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package.

Table 1-1 lists the differences between the CBB, CBC, and CUS packages.

• OMAP325 and OMAP3530 Applications Processor:
  • OMAP™ 3 Architecture
  • MPU Subsystem
    • Up to 600-MHz ARM Cortex™-A8 Core
    • NEON™ SIMD Coprocessor
  • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
    • Up to 520-MHz TMS320C64x+™ DSP Core
    • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
    • Video Hardware Accelerators
  • POWERVR SGX™ Graphics Accelerator (OMAP3530 Device Only)
    • Tile Based Architecture Delivering up to 10 MPoly/sec
    • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
    • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
    • Fine Grained Task Switching, Load Balancing, and Power Management
    • Programmable High Quality Image Anti-Aliasing
  • Fully Software-Compatible With C64x and C64x and ARM9™
  • Commercial and Extended Temperature Grades
• Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
  • Eight Highly Independent Functional Units
    • +Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
    • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
  • Load-Store Architecture With Non-Aligned Support
  • 64 32-Bit General-Purpose Registers
  • Instruction Packing Reduces Code Size
  • All Instructions Conditional
  • Additional C64x+™ Enhancements
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
    • Hardware Support for Modulo Loop Operation
• C64x+ L1/L2 Memory Architecture
  • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
  • 80K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
  • 64K-Byte L2 Unified Mapped RAM/Cache (4-Way Set-Associative)
  • 32K-Byte L2 Shared SRAM and 16K-Byte L2 ROM
• C64x+ Instruction Set Features
  • Byte-Addressable (8-/16-/32-/64-Bit Data)
  • 8-Bit Overflow Protection
  • Bit-Field Extract, Set, Clear
  • Normalization, Saturation. Bit-Counting
  • Compact 16-Bit Instructions
  • Additional Instructions to Support Complex Multiplies
• ARM Cortex™-A8 Core
  • ARMv7 Architecture
    • Trust Zone®
    • Thumb®-2
    • MMU Enhancements
  • In-Order, Dual-Issue, Superscalar Microprocessor Core
  • NEON™ Multimedia Architecture
  • Over 2x Performance of ARMv6 SIMD
  • Supports Both Integer and Floating Point SIMD
  • Jazelle® RCT Execution Environment Architecture
  • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
  • Embedded Trace Macrocell (ETM) Support for Non-Invasive Debug
• ARM Cortex™-A8 Memory Architecture:
  • 16K-Byte Instruction Cache (4-Way Set-Associative)
  • 16K-Byte Data Cache (4-Way Set-Associative)
  • 256K-Byte L2 Cache
• 112K-Byte ROM
• 64K-Byte Shared SRAM
• Endianess:
  • ARM Instructions - Little Endian
  • ARM Data – Configurable
  • DSP Instruction/Data - Little Endian
• External Memory Interfaces:
  • SDRAM Controller (SDRC)
    • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
    • Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM
    • SDRAM Memory Scheduler (SMS) and Rotation Engine
  • General Purpose Memory Controller (GPMC)
    • 16-bit Wide Multiplexed Address/Data Bus
    • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
    • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
    • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
    • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)
  • System Direct Memory Access (sDMA) Controller (32 Logical Channels With Configurable Priority)
  • Camera Image Signal Processing (ISP)
    • CCD and CMOS Imager Interface
    • Memory Data Input
    • RAW Data Interface
    • BT.601/BT.656 Digital YCbCr 4:2:2 (8-/10-Bit) Interface
    • A-Law Compression and Decompression
    • Preview Engine for Real-Time Image Processing
    • Glueless Interface to Common Video Decoders
    • Histogram Module/Auto-Exposure, Auto-White Balance, and Auto-Focus Engine
    • Resize Engine
      • Resize Images From 1/4x to 4x
      • Separate Horizontal/Vertical Control
  • Display Subsystem
    • Parallel Digital Output
      • Up to 24-Bit RGB
      • HD Maximum Resolution
      • Supports Up to 2 LCD Panels
      • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
    • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
      • Composite NTSC/PAL Video
      • Luma/Chroma Separate Video (S-Video)
    • Rotation 90-, 180-, and 270-degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-bit Alpha Blending
  • Serial Communication
    • 5 Multichannel Buffered Serial Ports (McBSPs)
      • 512 Byte Transmit/Receive Buffer (McBSP1/3/4/5)
      • 5K-Byte Transmit/Receive Buffer (McBSP2)
      • SIDETONE Core Support (McBSP2 and 3 Only) For Filter, Gain, and Mix Operations
      • Direct Interface to I2S and PCM Device and TDM Buses
      • 128 Channel Transmit/Receive Mode
    • Four Master/Slave Multichannel Serial Port Interface (McSPI) Ports
    • High-Speed/Full-Speed/Low-Speed USB OTG Subsystem (12-/8-Pin ULPI Interface)
    • High-Speed/Full-Speed/Low-Speed Multiport USB Host Subsystem
      • 12-/8-Pin ULPI Interface or 6-/4-/3-Pin Serial Interface
      • Supports Transceiverless Link Logic (TLL)
    • One HDQ/1-Wire Interface
    • Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
    • Three Master/Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • Removable Media Interfaces:
    • Three Multimedia Card (MMC)/ Secure Digital (SD) With Secure Data I/O (SDIO)
  • Comprehensive Power, Reset, and Clock Management
    • SmartReflex™ Technology
    • Dynamic Voltage and Frequency Scaling (DVFS)
  • Test Interfaces
    • IEEE-1149.1 (JTAG) Boundary-Scan Compatible
    • Embedded Trace Macro Interface (ETM)
    • Serial Data Transport Interface (SDTI)
  • 12 32-bit General Purpose Timers
  • 2 32-bit Watchdog Timers
  • 1 32-bit 32-kHz Sync Timer
  • Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • 6 5-nm CMOS Technology
  • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
  • Discrete Memory Interface (Not Available in CBC Package)
  • Packages:
    • 515-pin s-PBGA package (CBB Suffix), .5mm Ball Pitch (Top), .4mm Ball Pitch (Bottom)
    • 515-pin s-PBGA package (CBC Suffix), .65mm Ball Pitch (Top), .5mm Ball Pitch (Bottom)
    • 423-pin s-PBGA package (CUS Suffix), .65mm Ball Pitch
  • 1.8-V I/O and 3.0-V (MMC1 only), 0.985-V to 1.35-V Adaptive Processor Core Voltage 0.985-V to 1.25-V Adaptive Core Logic Voltage Note: thee are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex™ AVS.
  • Applications:
    • Portable Navigation Devices
    • Portable Media Player
    • Advanced Portable Consumer Electronics
    • Digital TV
    • Digital Video Camera
    • Portable Data Collection
    • Point-of-Sale Devices
    • Gaming
    • Web Tablet
    • Smart White Goods
    • Smart Home Controllers
    • Ultra Mobile Devices

POWERVR SGX is a trademark of Imagination Technologies Ltd. OMAP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

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