SN74AHCT16374是TI公司的一款D类触发器产品，SN74AHCT16374是具有三态输出的 16 位边沿 D 类触发器，本页介绍了SN74AHCT16374的产品说明、应用、特性等，并给出了与SN74AHCT16374相关的TI元器件型号供参考。
SN74AHCT16374 - 具有三态输出的 16 位边沿 D 类触发器 - D类触发器 - 触发器/锁存器/寄存器 - TI公司（Texas Instruments，德州仪器）
The 'AHCT16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.
A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
The SN54AHCT16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16374 is characterized for operation from -40°C to 85°C.
- Members of the Texas Instruments WidebusTM Family
- EPICTM (Enhanced-Performance Implanted CMOS) Process
- Inputs Are TTL-Voltage Compatible
- Distributed VCC and GND Pins Minimize High-Speed Switching Noise
- Flow-Through Architecture Optimizes PCB Layout
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
