TPS50601-SP - V 类 1.6V 至 6.3V 输入、6A 同步降压 SWIFT 转换器
TPS50601-SP是TI公司的一款转换器(集成开关)产品,TPS50601-SP是V 类 1.6V 至 6.3V 输入、6A 同步降压 SWIFT 转换器,本页介绍了TPS50601-SP的产品说明、应用、特性等,并给出了与TPS50601-SP相关的TI元器件型号供参考。
TPS50601-SP - V 类 1.6V 至 6.3V 输入、6A 同步降压 SWIFT 转换器 - 转换器(集成开关) - DC/DC开关稳压器 - TI公司(Texas Instruments,德州仪器)
产品特性
- 5962R10221:
- Radiation Hardness Assurance (RHA) up to TID 100 krad (Si)
- ELDRS Free 100 krad (Si) – 10 mRAD(Si)/s
- Single Event Latchup (SEL) Immune to LET = 85 MeV-cm2/mg (See Radiation Report)
- SEB and SEGR Immune to 85 MeV-cm2/mg, SOA Curve Available (See Radiation Report)
- SET/SEFI Cross-Section Plot Available (See Radiation Report)
- Peak Efficiency: 95% (VO = 3.3 V)
- Integrated 55-mΩ/50-mΩ MOSFETs
- Split Power Rail: 1.6 to 6.3 V on PVIN
- Power Rail: 3 to 6.3 V on VIN
- 6-A Maximum Output Current
- Flexible Switching Frequency Options:
- 100-kHz to 1-MHz Adjustable Internal Oscillator
- External Sync Capability: 100 kHz to 1 MHz
- Sync Pin can be Configured as a 500-kHz Output for Master/Slave Applications
- 0.795-V ±1.258% Voltage Reference at 25°C
- Monotonic Start-Up into Prebiased Outputs
- Adjustable Soft Start Through External Capacitor
- Input Enable and Power-Good Output for Power Sequencing
- Power Good Output Monitor for Undervoltage and Overvoltage
- Adjustable Input Undervoltage Lockout (UVLO)
- 20-Pin Thermally-Enhanced Ceramic Flatpack Package (HKH)
- See www.ti.com/swift for SWIFT™ Documentation
- See the Tools & Software Tab
Efficiency vs Load Current, Vin = 5 V
产品应用
- Space Satellite Point of Load Supply for FPGAs, Microcontrollers, and ASICs
- Space Satellite Payloads
- Radiation-Tolerant Applications
- Available in Military (–55°C to 125°C) Temperature Range
- Engineering Evaluation (/EM) Samples are Available(1)
产品说明
The TPS50601-SP is a radiation hardened, 6.3-V, 6-A synchronous step-down converter, which is optimized for small designs through high efficiency and integrating the high-side and low-side MOSFETs. Further space savings are achieved through current mode control, which reduces component count, and a high switching frequency, reducing the inductor's footprint. The devices are offered in a thermally enhanced 20-pin ceramic, dual in-line flatpack package.
Device Information(2)
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS50601-SP | CFP (20) | 7.38 × 12.70 mm |
KGD(3) | N/A(4) |
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