TPS826721是TI公司的一款非隔离式模块产品,TPS826721是采用 MicroSiP(TM) 封装的 600mA 完全集成式低噪声降压转换器模块,本页介绍了TPS826721的产品说明、应用、特性等,并给出了与TPS826721相关的TI元器件型号供参考。
TPS826721 - 采用 MicroSiP(TM) 封装的 600mA 完全集成式低噪声降压转换器模块 - 非隔离式模块 - 电源模块 - TI公司(Texas Instruments,德州仪器)
- 90% Efficiency at 5.5MHz Operation
- 17μA Quiescent Current
- Wide VIN Range From 2.3V to 4.8V
- 5.5MHz Regulated Frequency Operation
- Spread Spectrum, PWM Frequency Dithering
- Best in Class Load and Line Transient
- ±2% Total DC Voltage Accuracy
- Automatic PFM/PWM Mode Switching
- Low Ripple Light-Load PFM Mode
- ≥35dB VIN PSRR (1kHz to 10kHz)
- Internal Soft Start, 120-µs Start-Up Time
- Integrated Active Power-Down Sequencing (Optional)
- Current Overload and Thermal Shutdown Protection
- Sub 1-mm Profile Solution
- Total Solution Size <6.7 mm2
- Cell Phones, Smart-Phones
- Camera Module, Optical Data Module
- Wearable Electronics
- Digital TV, WLAN, GPS and Bluetooth™ Applications
- POL Applications
The TPS8267x device is a complete 600mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design.
The TPS8267x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSiP™ DC/DC converter operates at a regulated 5.5-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range.
The PFM mode extends the battery life by reducing the quiescent current to 17μA (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency.
The TPS8267x is packaged in a compact (2.3mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS8267x | µSIP (8) | 2.30 x 2.90 mm |