TPS8268180是TI公司的一款非隔离式模块产品,TPS8268180是1.6A、高效 MicroSiP? 降压转换器模块,本页介绍了TPS8268180的产品说明、应用、特性等,并给出了与TPS8268180相关的TI元器件型号供参考。
TPS8268180 - 1.6A、高效 MicroSiP? 降压转换器模块 - 非隔离式模块 - 电源模块 - TI公司(Texas Instruments,德州仪器)
- Wide VIN Range From 2.5V to 5.5V
- Total Solution Size < 6.7 mm2
- Sub 1-mm Profile Solution
- ±1.5% DC Voltage Accuracy
- Up to 1600-mA Load Current
- Up to 90% Efficiency
- Fixed Output Voltage:
- TPS8268180: 1.80V
- TPS8268150: 1.50V
- TPS8268120: 1.20V
- TPS8268105: 1.05V
- TPS8268090: 0.90V
- Low EMI by Spread Spectrum PWM Frequency Dithering
- Best in Class Load and Line Transient Response
- Internal Soft Start
- Current Overload and Thermal Shutdown Protection
- Optical Modules
- Cell Phones, Smart-Phones
- Solid State Disk Drive Applications
- Space constrained applications
The TPS8268x device is a complete DC/DC step-down power supply optimized for small solution size. Included in the package are the switching regulator, inductor and input/output capacitors. Integration of all passive components enables a tiny solution size of only 6.7mm2.
The TPS8268x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications in which high load currents in a very small solution size and height are required. The TPS8268x is optimized for high efficiency and low output voltage ripple and supports up to 1600-mA load current. With an input voltage range of 2.5-V to 5.5-V, the device supports applications powered by Li-Ion batteries as well as 5-V and 3.3-V rails.
The TPS8268x operates at a 5.5-MHz switching frequency with spread spectrum capability. For noise-sensitive applications, this provides a lower noise regulated output, as well as low noise at the input. The device supports a fixed output voltage, requiring no external feedback network.
These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency with the same size.
The TPS8268x is packaged in a compact (2.3mm x 2.9mm) and low profile BGA package suitable for automated assembly by standard surface mount equipment.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS8268180 | µSIP | 2.30 mm × 2.90 mm |
TPS8268150 | µSIP | 2.30 mm × 2.90 mm |
TPS8268120 | µSIP | 2.30 mm × 2.90 mm |
TPS8268105 | µSIP | 2.30 mm × 2.90 mm |
TPS8268090 | µSIP | 2.30 mm × 2.90 mm |